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LED radiator cooling method

This is the most common way of cooling, using aluminum fin as part of the shell to increase the heat dissipation area.
Thermal conductive plastic shell
The use of LED insulation cooling plastic instead of aluminum alloy to make heat dissipation body can greatly improve the thermal radiation capability.
Surface radiating heat treatment
The surface of the lamp shell for radiation heat dissipation treatment, simple is to apply radiation heat dissipation paint, heat can be radiated away from the lamp shell surface.
Air hydrodynamics.
Making use of the shape of the lamp shell to create convection air is the minimum cost to enhance the heat dissipation.
The interior of the lamp housing is strengthened by heat dissipation fan, which has low cost and good effect. But to change the fan is troublesome and not suitable for outdoor use. This design is relatively rare.
Heat conduction tube
Using heat conduction tube technology, heat is transmitted from the LED chip to the radiator fin. Large lamps and lanterns, such as street lamps, are common designs.
Liquid bubble
Using liquid bubble encapsulation technology, transparent liquid with high thermal conductivity is filled into the bulb. This is in addition to the principle of reflector, the only technology that uses LED chip to produce heat and heat dissipation.
Utilization of lamp holder
In the home LED lamp with small power, it often uses the interior space of the lamp head to put part or all of the heating driving circuit into it. This can be done by using a lamp head with a larger metal surface, such as a spiral socket lamp head, because the lamp head is tightly connected to the metal electrode of the lamp holder and the power line. So a part of the heat can be derived from the heat dissipation.
Integration of heat conduction and heat dissipation -- Application of high thermal conductivity ceramics
The purpose of heat dissipation is to reduce the operating temperature of LED chips. Because the expansion coefficient of LED chips is very different from the expansion coefficient of metal thermal conductivity and heat dissipation materials commonly used by us, the LED chips can not be directly welded to avoid high and low temperature thermal stress destroying the LED chips. The latest high thermal conductivity ceramic material has a thermal conductivity close to aluminum, and the expansion system can be adjusted to synchronize with the LED chip. In this way, heat conduction and heat dissipation can be integrated to reduce the heat transfer intermediate links.