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Radiator cooling mode


  The way of heat dissipation is the main way to dissipate heat of the radiator. In thermodynamics, heat dissipation is heat transfer, and there are three main ways of heat transfer: heat conduction, heat convection and heat radiation. The transfer of energy is called heat conduction either by matter itself or when it comes into contact with matter. This is the most common form of heat transfer. For example, the way that CPU heat sink base contacts directly with CPU and takes away heat is heat conduction. Thermal convection refers to the flow of fluid (gas or liquid) will go tropical heat transfer mode, the more common in the computer cabinet heat dissipation system is the fan driven air flow "forced thermal convection" cooling mode. Thermal radiation refers to the transfer of heat by radiation. The most common form of solar radiation is solar radiation. None of the three modes of heat dissipation is isolated. In the daily heat transfer, these three modes of heat dissipation occur simultaneously and work together.
  In fact, any type of radiator will basically use the above three modes of heat transfer at the same time, but the focus is different. For example, ordinary CPU radiators, CPU fins and CPU surface contact directly, CPU surface heat transfer to the CPU fin through heat conduction; radiator fan generated air flow through heat convection to the surface of the CPU fin heat transfer; and the air flow in the chassis is also through heat convection to the air around the CPU fin heat transfer. Until the chassis is outside, at the same time, all parts with high temperature will have thermal radiation to the parts with low ambient temperature.
  The heat dissipation efficiency of the radiator is related to the heat conductivity of the radiator material, the heat capacity of the radiator material and the heat dissipation medium, and the effective heat dissipation area of the radiator. According to the way the heat is taken away from the radiator, the radiator can be divided into active and passive heat dissipation, the former is commonly air-cooled radiator, and the latter is commonly the radiator. Further subdividing the heat dissipation mode can be divided into air cooling, heat pipe, liquid cooling, semiconductor refrigeration and compressor refrigeration and so on.
  Air-cooled heat dissipation is the most common, and very simple, is the use of fans to take away the heat absorbed by the radiator. It has the advantages of relatively low price and simple installation, but it is highly dependent on the environment. For example, the heat dissipation performance will be greatly affected when the temperature rises and the frequency is over.
  Heat pipe is a kind of heat transfer element with high thermal conductivity. It transfers heat through evaporation and condensation of liquid in a fully enclosed vacuum tube. It takes advantage of the fluid principle such as gross suction to achieve the refrigeration effect similar to that of a refrigerator compressor. It has a series of advantages, such as high thermal conductivity, good isotherm, heat transfer area on both sides can be changed arbitrarily, long-distance heat transfer, controllable temperature and so on. Because of its special heat transfer characteristics, it can control the wall temperature and avoid dew point corrosion.
  Liquid cooling is the use of liquid driven by the pump forced circulation to take away the heat radiator, compared with air cooling has quiet, stable cooling, less dependence on the environment and so on. However, the price of heat pipe and liquid cooling is relatively high, and installation is relatively troublesome.